The world's leading chipmaker is planning to join hands with Japanese companies to develop semiconductor manufacturing technology.
Japan's government plans to contribute about 19 billion yen, or about 173 million dollars, to the project involving Taiwan Semiconductor Manufacturing. Its research facility will be in Tsukuba, Ibaraki Prefecture, near Tokyo.
The Japanese firms will include Ibiden and Shibaura Mechatronics, which make chip materials and manufacturing equipment.
The group will aim to establish so-called "3D packaging" technology. This involves piling up chips to achieve better performance and energy efficiency.
Advanced-chip development has been stepped up globally, as the devices are indispensable for next-generation telecommunication networks and autonomous driving.
Some governments are investing heavily in their domestic industries to promote digitalization and bolster their economic security.